MPi Wafer Probe Cards






Canteliver Probe Card

MPI Cantilever Probe Card is greatly utilized on gold bump and pad wafer tests for Show driver, logic, and memory product. MPI’s cantilever probes are classified as the corresponding respond to towards the needs of fi­ne pitch, smaller pad sizing, high speed, a lot less cleansing, multi-DUT, superior pin depend, and extremely-low leakage prerequisites. With outstanding craftsmanship, modern architecture and demonstrated methodologies dependant on mechanical and electrical simulation/measurement results, making MPI the top cantilever provider globally.


FCB Probe Card

The FCB Probe Card is the most mature technology of buckling beam probe card. It's aimed to attain the semiconductor ship manufacture time-to-marketplace (TTM) and cost of test (COT) demand from customers. FCB is usually a tested Option for a range of semiconductor generation exams from early engineering pilot-runs to high quantity production (HVM). FCB is ready for machine necessitating large signal integrity probing (SI) and/or ability integrity probing (PI). Apps contain cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and more. FCB assures the earth’s greatest overall Charge-of-ownership (COO) for various DUT apps.


EVS Probe Card

The EVS Probe Card is surely an improvement in excess of the conventional buckling beam probe card. Vital characteristics are higher latest carrying capacity (C.C.C.) and lessen balanced Call power (BCF), and All round MEMS-like characteristics. EVS can easily meet the necessity of Highly developed wafer probing. Exact alignment and great planarity Manage tend to be the important components contributing to stable Speak to resistance. With its potential and efficiency, EVS Probe Card is a super choice for Superior probe playing cards.


Osprey probe card

The Osprey probe card is MPI’s Alternative to need for ever finer pitch. It can be suitable for smaller sized Al pad, and is also perfect for very small pitch application with peripheral and total array sample. With specific alignment and improved planarity Manage, Osprey can achieve better efficiency by multi-DUT structure.  The forming wire (FW) kind needle made with MPI’s very own micro fabrication method not merely delivers large-good quality functionality but in addition makes it possible for uncomplicated needle alternative and shortens keeping cycle time.



Kestrel Probe Card

The Kestrel Probe Card is supplied with MEMS wire (MW) needle that is designed for the demand from customers of small drive probing. What's more, it includes the chance to fulfill significant C.C.C. and superior pin counts software. The MEMS method guarantees highly dependable needle features, along with the Particular structure structure allows precise alignment and planarity Command.


MPI probe card division provides a wide range of solutions click here to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

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